PC302 HSPA+ SoC

The PC302 is the first in the PC3xx family of highly integrated baseband systems-on-chip (SoCs) aimed at the fast-growing femtocell market. The devices substantially reduce manufacturers' bill-of-materials costs, allowing the production of femtocells at consumer price points.

The four-user PC302 embodies five years of intense development and design effort, extensive field trials and interoperability testing with over 100 handsets. It implements a complete 3GPP Release 7 access point, offering OEMs a high level of confidence that they can quickly complete designs that will attain outstanding performance in practice and will conform to regulatory standards.

The PC302 is built using an advanced 65nm manufacturing process, to deliver the lowest bill-of-materials and lowest power for a femtocell available today. It is compliant to TR25.820 and the newly standardized Iu-h interface.

It is designed for use in residential and SME femtocell access points. It implements 64QAM and hence offers data rates of up to 21Mbit/s and 5.7Mbit/s in downlink and uplink respectively.

Based on Picochip’s robust, field-proven PC8208/PC8209 software reference design, the PC302 integrates a 3GPP NodeB modem, RNC stack, Radio Resource Management, cryptographic engine, high-speed accelerators, synchronization, network listen functionality and peripherals.

Like all members of the PC3xx family, the PC302 provides the flexibility and processing power demanded by users requiring an upgrade path to technologies such as LTE, HSPA+ and MIMO. Its architecture also provides the flexibility for in-field upgrades and offers spare processing power for customer enhancements and home networking functions.